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102399-3
| 制造商 | TE Connectivity Ltd. |
| 描述 | Contact SKT Crimp ST Cable Mount Contacts-AMPMODU Machine Applied CONN TERM RECEPT 22-26AWG 30GOLD Headers & Wire Housings MT RECP LP MT RECP LP MT RECP LP Search Keywords:.031, .050, .100, .125, .156 C/L Interconnection System, wire to board, NIC, Network Interface Cards, PC Cards, AMPMODU |
| 分类 |
商业参数
| 商标名 | AMPMODU | 标准包装规格 | 1,000 |
| 产品类别 | Headers & Wire Housings | 标准包装数量 | Bulk |
| 工厂包装数量 | 1000 | ||
合规参数
| RoHS | Contains lead / RoHS non-compliant | 无铅定义 | Not relevant for lead free process |
| RoHS/ELV合规状态 | Not ELV/RoHS compliant | ||
电气参数
| 连接器阻抗 | 刺破式压接 (IDC), 压接 | 最大额定电流 | 5 A |
机械参数
| 包装方式 | Bulk | 导线线规 | 22-26 AWG |
| 端接方式 | Crimp | 触头类型 | Signal |
| 插针或插孔 | Socket | 连接器类型 | Connector Headers and PCB Receptacles |
| 接触镀层 | Gold Over Nickel | 压力(PSI) | 标准 |
| 插入件材料 | 铜合金 | 触头材料 | Copper Alloy |
| 包装数量 | 1000 | 绝缘高度 | 是 |
| 端接样式 | 插座 | 第一触头极性 | Socket (Female) |
| 接触件端接 | IDC | 绝缘直径 | 1.27 [0.050] |
| 镀层厚度(通用) | 锡铅 | 接触镀层厚度 | 30µin (0.76µm) |
| 线规或范围 - mm² | 0.12-0.40² [26-22] | 触点镀层厚度 - 柱(配合端) | 50 |
产品信息
| 连接器性别 | SKT | 系列 | AMPMODU MT |
| 制造商全称 | AMP | 产品子类型 | Contacts |
文档与媒体
相关型号

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