TE Connectivity Ltd.- 陶瓷电容器
陶瓷电容器 - 型号列表
共 258 个型号| 制造商零件编号 | 库存 | 价格 | 标准包装数量 | RoHS | 端接方式 | 接触镀层 | 类型 | 产品特性 | 安装类型 | 排数 | 间距 | 连接器性别 | 触点数 | 位数 | 安装样式 | 触头材料 | 壳体材料 | 产品类别 | 工厂包装数量 | 包装方式 | 工作温度 | 高度 | 总长度 | 接触镀层厚度 | 材料阻燃等级 | 深度 | 位置或引脚数（网格） | 产品 | 端接样式 | 连接器类型 | 制造商全称 | 抗辐射加固 | 接触电阻 | 绝缘电阻 | 排间距 | 绝缘材料 - 类型 | 系列 | RoHS/ELV合规状态 | 颜色 | 连接器样式 | 外形（宽 x 高） | 端子柱长度 | 产品子类型 | 适用产品/相关产品 | 无铅定义 | 开关功能 | 温度额定值 | 最大额定电流 | 包装数量 | 触头类型 | 尖端材料（笔尖） | 壳体镀层 | 端口数 | 长度 | 底座类型 | 引脚数 | 已删除 | 主要用途 | 输出配置 | 其他名称 | 镀层 | 壳体颜色 | 极化 | 插入件材料 | 安装特性 | 面板安装类型 | 海关税号 | 最小供电电压 | 重量 | 结工作温度 | 交货时间 | 子类别 | 材料（通用） | 宽度 | 尺寸/外形 | 额定交流电压 | 引脚样式 | 兼容外壳尺寸（如TM-700等） | 触头长度-柱 | 典型触点布局 | 可堆叠 | 接触件端接 | 温度 | 外壳样式 | 柱间距 | 高度（英寸） | 备注 | 专有名称 | 其他规格 | 温度范围 | 输入电阻 | 钳位电压 | 致动器类型 | 衬套/护套类型 | 装配配置 | 封装热阻 | 第一连接器安装类型 | 密封型 | 轴径尺寸 | 表面贴装焊盘尺寸 | 机械寿命 | 行业别名 | 零件号别名 | 防护类型 | 零件状态 | 直径 | 螺柱/焊片尺寸 | 绝缘颜色 | 主要材料 | 内径（直径） | 连接器颜色 | 外径 | 最大电缆长度 | 绝缘材料 - 材质 | 保护管长度 | 最高温度限值 | 引脚长度（针脚） | 封装形式 | 标准包装规格 | 占位面积 | 锁定类型 | 本体尺寸 | 外壳表面处理 | 外壳颜色 | 插针或插孔 | 外壳镀层 | 法兰特征 | 外壳材料（壳体） | 锁定特性 | 面板厚度 | 中心触点镀层工艺 | 中心触点材料 | 接触件表面处理 - 配合 | 后壳材料及镀层 | 堆叠方法 | 端接排数 | 第一连接器类型 |
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 Conn DIP Socket SKT 8 POS 2.54mm Solder ST Thru-Hole Tube DIP Sockets CONN IC SOCKET 8POS DIP TIN IC Socket DIP8 2.54mm Diplomate IC & Component Sockets DIP-8 W/RET TAILS Conn DIP Socket SKT 8 POS 2.54mm Solder ST Thru-Hole Tube Product Highlights:DIP SocketNumber of Positions = 8Row-to-Row Spacing = 7.87 mmThru HoleMount Style = VerticalSearch Keywords:IC sockets, solderless, NIC, Network Interface Cards, PC Cards, EIA RS-415, MIL-S-83734, dual in-line IC package, Socket,DIP;8Pins;DualLeaf;Open;SolderTail;0.31In.;BerylliumCopper;Tin te connectivity / amp | 1697 | 1: ¥2.448 | Bulk | Lead free / RoHS Compliant | Solder | Tin | DIP Socket | Closed Frame | Through Hole | 2 | 2.54 mm | SKT | 8 | Not Required | PCB | Beryllium Copper | Thermoplastic | IC & Component Sockets | 52 | Tube | +105°C | 5.33 mm | 10.03 mm | - | - | 10.01mm | 8 (2 x 4) | DIP / SIP Sockets | Through Hole | - | - | No | 30 mohm | 10000 Mohm | 7.62mm | Thermoplastic | Diplomate DL, AMP | - | - | - | - | - | - | - | - | - | - | - | - | Stamped | - | - | - | 10.03mm | DIP | 8 (2 x 4) | Compliant | Closed Frame | Through Hole | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 5.33mm | 10.03 x 5.33 x 10.01mm | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
 Conn DIP Socket SKT 28 POS 2.54mm Solder ST Thru-Hole Tube DIP Sockets CONN SOCKET VERT 28 POS TIN DIP Diplomate DIP Socket 2.54x15.49mm 28P Socket; DIP;Dual Leaf;28 Pos.;0.100In.cen.;Thru Hole;0.610In.;Ber. Copper;Tin;0. IC & Component Sockets 28C DL SOCKET Conn DIP Socket SKT 28 POS 2.54mm Solder ST Thru-Hole Tube Product Highlights:DIP SocketNumber of Positions = 28Row-to-Row Spacing = 15.49 mmThru HoleMount Style = VerticalSearch Keywords:IC sockets, solderless, NIC, Network Interface Cards, PC Cards, EIA RS-415, MIL-S-83734, dual in-line IC package, Socket,DIP;DualLeaf;28Pos.;0.100In.cen.;ThruHole;0.610In.;Ber.Copper;Tin;0. te connectivity / amp | 3776 | 1: ¥6.12 | Bulk | Lead free / RoHS Compliant | Solder | Tin | DIP Socket | Closed Frame | Through Hole | 2 | 2.54 mm | SKT | 28 | Not Required | Through Hole | Beryllium Copper | Glass Fibre Reinforced Thermoplastic | IC & Component Sockets | 1500 | Tube | +105°C | 5.33 mm | 35.43 mm | - | UL 94 V-0 | 17.63 mm | 28 (2 x 14) | DIP / SIP Sockets | - | - | - | No | 30 mohm | 10000 Mohm | 15.49mm | Thermoplastic | - | - | - | - | - | - | - | - | - | - | - | - | - | Stamped | - | - | - | - | - | - | Compliant | - | - | 26416151 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
 Conn SCSI PL 50 POS 2.54mm Solder ST Thru-Hole 50 Terminal 1 Port 1.27 [.050] Series I, HD, FH and J Connectors CONN PLUG 50POS VERT .050 T/H Board to Board & Mezzanine Connectors 050 SER I 50P PLUG ASSY Conn SCSI PL 50 POS 2.54mm Solder ST Thru-Hole 50 Terminal 1 Port Product Highlights:ConnectorApplies To Printed Circuit BoardHousing Gender = Plug50 Positions1.27 mm Centerline Champ050 series,50pos,Au over PdNi te connectivity / amp | 16 | 1: ¥33.4282 | Bulk | Lead free / RoHS Compliant | Solder | Tin | SCSI | Board Lock | Through Hole | 2 | 2.54 mm | PL | 50 | 50 | Thru Hole | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Board to Board & Mezzanine Connectors | 1296 | 管 | -55 – 105 °C [ -67 – 221 °F ] | 10 mm | 1.27 [0.050] | Flash | UL 94V-0 | 7.1 mm | - | - | Through Hole | Series I | AMP | - | - | - | - | - | 系列 I | RoHS compliant, ELV compliant | Black | Center Strip Contacts | Standard | 2.54 [0.100] | Connector | Board To Board Applications | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c | With | Standard | 1 | 54 | - | Brass | Tin-Copper over Nickel | 1 Port | - | - | - | - | - | - | - | 哑光 | 黑色 | Keying Post | 磷青铜 | 板锁 | 通孔 | - | - | - | - | - | - | - | - | - | 250 | 正方形 | 母端组件 | 2.54 mm [ .099822 in ] | 网络 | 否 | - | - | - | - | - | - | - | - | - | 1000 | 750 | 带有 | 不带 | 无 | .8 – 1.6 mm [ .031 – .063 in ] | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
 Conn SCSI PL 100 POS 2.54mm Solder ST Thru-Hole 100 Terminal 1 Port 1.27 [.050] Series I, HD, FH and J Connectors PLUG ASSY,CHAMP 050,SER I,100P I/O Connectors VERT PLUG 100P Series I w/locks Conn SCSI PL 100 POS 2.54mm Solder ST Thru-Hole 100 Terminal 1 Port Product Highlights:ConnectorPlugNumber of Positions = 1001.27 mm CenterlineStandard Profile BOARD-BOARD CONNECTOR PLUG, 100WAY, 2ROW Champ050 series,100pos,Au over PdNi te connectivity / amp | 1543 | 1: ¥41.956 | Rail / Tube | Lead free / RoHS Compliant | Solder | Tin | SCSI | Board Lock | Through Hole | 2 | 2.54 mm | PL | 100 | 100 | Thru Hole | Phosphor Bronze | Liquid Crystal Polymer (LCP) | I/O Connectors | 864 | - | -55C to 85C | 10 mm | 1.27 [0.050] | Flash | UL 94V-0 | 7.1 mm | - | - | Solder Tail | Series I | AMP | - | - | - | - | - | :Champ 0.050 | RoHS compliant, ELV compliant | Black | Center Strip Contacts | Standard | 2.54 [0.100] | Connector | Board To Board Applications | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c | With | Standard | 1/Contact A | - | - | Brass | Tin-Copper over Nickel | 1 Port | - | - | - | - | - | - | A33459 | - | - | Keying Post | - | - | - | 85366930 | 250VAC | 0 | 85C | - | - | - | - | - | - | - | - | - | - | - | :Through Hole Vertical | - | - | - | - | - | - | - | - | - | - | - | - | - | - | :PCB | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
 Conn DIP Socket SKT 8 POS 2.54mm Solder ST Thru-Hole Tube DIP Sockets CONN SOCKET DIP 8POS VERT T/H IC & Component Sockets 8P DIP HI TEMP PHBZ 8P DIP HI TEMP PHBZ 2-382462-3 Conn DIP Socket SKT 8 POS 2.54mm Solder ST Thru-Hole Tube Product Highlights:DIP SocketNumber of Positions = 8Row-to-Row Spacing = 7.87 mmThru HoleMount Style = VerticalSearch Keywords:IC sockets, solderless, NIC, Network Interface Cards, PC Cards, EIA RS-415, MIL-S-83734, dual in-line IC package, te connectivity / amp | 1627 | 1: ¥2.584 | Rail / Tube | Lead free / RoHS Compliant | Solder | Tin | DIP Socket | Closed Frame | Through Hole | 2 | 2.54 mm | SKT | 8 | - | Through Hole | Phosphor Bronze | Polyester | IC & Component Sockets | 52 | Tube | + 105 C | - | - | - | - | - | 8 (2 x 4) | DIP / SIP Sockets | Solder | - | - | - | - | - | 7.87 mm | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
 CONN SCSI F 30 POS 1.27MM SLDR ST TH 30TERM Board to Board & Mezzanine Connectors .050CL CHAMP VERT RC 1.27 [.050] Series I, HD, FH and J Connectors CONN CHAMP RCPT 30POS .050 VERT CHAMP 050 BTB REC V 30P W/LEG te connectivity / amp | 10 | 5000: ¥26.6084 | 5,400 | RoHS Compliant | Solder | Gold (8) | Board to Board, High Density | Board Lock | Vertical | 2 | 1.27 mm [ .05 in ] | Receptacle | - | 30 | Thru Hole | Phosphor Bronze | Nylon | - | - | Tray | -55 – 85 °C [ -67 – 185 °F ] | 7 mm [ .275 in ] | 1.27 [0.050] | 8µin (0.20µm) | UL 94V-0 | - | - | - | 插座 | High Density (HD) | AMP | - | - | - | - | - | Series I | RoHS compliant, ELV compliant | Black | Outer Shroud Contacts | Standard | 3.10 [0.122] | Connector | Board To Board Applications | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c | Without | Standard | 1 | 150 | - | Brass | Tin over Nickel | - | - | - | - | - | - | - | - | - | 黑色 | - | 磷青铜 | 板锁 | 通孔 | - | - | - | - | - | - | - | - | - | 250 | 直角 | 插头组件 | 3.1 mm [ .123 in ] | 同轴 | No | - | Standard | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Without | 不带 | Without | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
Conn SIP Socket SKT 10 POS 2.54mm Solder ST Thru-Hole Tray CONN SOCKET SIP 10POS .100 GOLD te connectivity / amp | - | Bulk | Contains lead / RoHS non-compliant | Solder | Gold | SIP Socket | Closed Frame | Through Hole | 1 | 2.54 mm | SKT | 10 | - | - | - | - | - | - | - | - | - | - | 30µin (0.76µm) | - | - | 10 (1 x 10) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
Conn SIP Socket SKT 3 POS 2.54mm Solder ST Thru-Hole Tray SIP Sockets CONN SOCKETS SIP 3POS TIN IC & Component Sockets 3P SIP SOCKET Conn SIP Socket Strip SKT 3 POS 2.54mm Solder ST Thru-Hole Tray Conn SIP Socket Strip SKT 3 POS 2.54mm Solder ST Thru-Hole Tray Product Highlights:Number of Positions = 3Contact Style = Stamped + FormedLeg Style = StandardPhosphor Bronze Contact Base MaterialTin Contact Mating Area Plating MaterialSearch Keywords:single in-line IC package, NIC, Network Interface Cards, PC Cards, IC sockets, pc board mount, hybrid, EIA RS-415, MIL-S-83734, Table 23.1, UL 1410, te connectivity / amp | 10 | 2960: ¥3.4462 | Bulk | Contains lead / RoHS non-compliant | Solder | Tin-Lead | SIP Socket | Closed Frame | Through Hole | 1 | 2.54 mm | SKT | 3 | Not Required | Through Hole | Phosphor Bronze | Thermoplastic | IC & Component Sockets | 2960 | Tray | -55C to 105C | 5.33 mm | 7.49 mm | - | - | 3.91 mm | 3 (1 x 3) | DIP / SIP Sockets | - | - | - | No | 20 mohm | 5000 Mohm | - | Thermoplastic | Diplomate DL, AMP | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 3 (1 x 3) | - | Closed Frame | Through Hole | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
 Conn DIP Socket SKT 14 POS 2.54mm Solder ST Thru-Hole Tube DIP Sockets CONN IC SOCKET 14POS DIP 15AU IC & Component Sockets 14 CLOSED FRAME GOLD Conn DIP Socket SKT 14 POS 2.54mm Solder ST Thru-Hole Tube Product Highlights:DIP SocketNumber of Positions = 14Row-to-Row Spacing = 7.87 mmThru HoleMount Style = VerticalSearch Keywords:IC sockets, solderless, NIC, Network Interface Cards, PC Cards, EIA RS-415, MIL-S-83734, dual in-line IC package, SEE374-45521825093-3 te connectivity / amp | 821 | 200: ¥3.604 | Rail / Tube | Contains lead / RoHS non-compliant | Solder | Gold | DIP Socket | Closed Frame | Through Hole | 2 | 2.54 mm | SKT | 14 | Not Required | Through Hole | Phosphor Bronze | Thermoplastic | IC & Component Sockets | 30 | Tube | -55C to 125C | 5.33 mm | 17.65 mm | 15µin (0.38µm) | UL 94 V-0 | 10.01 mm | 14 (2 x 7) | DIP / SIP Sockets | - | - | - | No | 30 mohm | 10000 Mohm | 7.62 mm | Thermoplastic | Diplomate DL, AMP | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 14 (2 x 7) | - | Closed Frame | Through Hole | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
 CONN SCSI PL 68 POS 2.54MM SLDR RA TH 68TERM .050CL,CHAMP,R/TANG PLUG,68POS te connectivity / amp | 10 | 800: ¥63.055 | 80 | Contains lead / RoHS non-compliant | Solder | Gold | Board to Board | Board Lock | Through Hole, Right Angle | 2 | - | - | - | 68 | - | - | - | - | - | - | - | - | - | 30µin (0.76µm) | - | - | - | - | - | Plug | - | - | - | - | - | - | - | - | - | Center Strip Contacts | - | - | - | 5-5175472-8 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 56 Days | Connector SCSI | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 5175472-8 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
 Cable Accessories Terminator Solder & Shield Tubing .105 O/D .055 S/D Shield Terminators SOLDER SLEEVE IMMERS RESIS .650" Sleeve,Solder,ImmersionResistant,Transp Cable Accessories Shield Terminator Thermoplastic Blue Tin/Silver TERMINAL, SLEEVE, 2.65MM, BLUE SolderSleeve;ShieldTerminator;TransBlue;Polyvinylidene;16.5mmL;S01M83519Series te connectivity / raychem wire | 10084 | 1: ¥13.328 | Bulk | No | :Solder | :Tin | Wire to Wire | Immersion Resistant | - | - | - | - | - | - | - | :- | - | Solder & Shield Tubing | 100 | Bulk | - | - | - | - | No | - | - | - | - | :Solder Sleeve | S01M83519Series | - | - | - | - | - | S01 | - | Blue, Transparent | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0.650" (16.51mm) | - | - | - | - | - | - | - | - | - | - | - | - | 85369010 | - | 0.002 | - | - | - | PVDF | - | - | - | - | - | - | - | - | - | + 125 C | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 642145-000 | Sleeve,Solder | 642145-000 | 0.105" (2.6mm), 0.145" (3.7mm) | :- | :Blue | SolderSleeve | 0.105" | Blue | 2.65(0.105)mm(In.) | 2.65mm | :PVDF (Polyvinylidene Fluoride) | 16.5mm | + 150 C | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
 I/O Connectors VERT RECPT 100P Series I w/locks RCPT ASSY,CHAMP 050,SER I,100P TE Connectivity / AMP | - | 864 | Lead free / RoHS non-compliant | Solder | Gold | Board to Board | Board Guide, Board Lock | Through Hole | 2 | - | - | - | 100 | - | - | - | - | - | - | - | - | - | 30µin (0.76µm) | - | - | - | - | - | Receptacle | - | - | - | - | - | - | - | - | - | Outer Shroud Contacts | - | - | - | 1-1734101-0 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 137 Days | Connector SCSI | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
 Conn DIP Socket SKT 6 POS 2.54mm Solder ST Thru-Hole Tube DIP Sockets CONN IC SOCKET 6 POS DIP 15AU Dip socket 6 way 2.54mm Diplomate Socket; DIP;Dual Leaf;6 Pos.;0.100In.cen.;Thru Hole;0.310In.;Phosphor Bronze IC & Component Sockets 6P CLOSED FRAME GOLD Conn DIP Socket SKT 6 POS 2.54mm Solder ST Thru-Hole Tube Search Keywords:IC sockets, solderless, NIC, Network Interface Cards, PC Cards, EIA RS-415, MIL-S-83734, dual in-line IC package, DIP SOCKET, 6POS, THROUGH HOLE Socket,DIP;DualLeaf;6Pos.;0.100In.cen.;ThruHole;0.310In.;PhosphorBronze te connectivity / amp | 2000 | 1: ¥2.6996 | Rail / Tube | Lead free / RoHS Compliant | Solder | Tin | DIP Socket | Closed Frame | Through Hole | 2 | 2.54 mm | SKT | 6 | 6 | Vertical | Phosphor Bronze | Thermoplastic Glass Reinforced | IC & Component Sockets | 70 | Tube | +125°C | 5.33 mm | 2.54 [0.100] | 15µin (0.38µm) | UL 94V-0 | 0.21in | 6 (2 x 3) | DIP / SIP Sockets | Solder Tail | :DIP Socket | Tyco Electronics | No | 30 | 10,000 | 0.3in | Thermoplastic | :DIPLOMATE DL | RoHS compliant, ELV compliant | Black | - | Standard | 3.25 [0.128] | DIP Socket | - | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c | - | - | - | Tube | Dual Leaf | - | - | - | 0.295in | Closed Frame | - | - | - | - | - | - | - | - | - | - | - | 85366910 | - | 0.002 | - | - | - | - | 0.394in | 0.295 x 0.394 x 0.21in | - | - | - | - | - | - | :Through Hole Vertical | - | Closed | 7.62 [0.300] | 5.33 [0.210] | ONLY sockets with straight solder tails are recommended for automatic insertion | DIPLOMATE DL | Straight | 125 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | :0.125" | DIP | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
Conn SIP Socket SKT 19 POS 2.54mm Solder ST Thru-Hole Tray CONN SOCKET SIP 19POS .100 TIN te connectivity / amp | - | Bulk | Lead free / RoHS Compliant | Solder | Tin | SIP Socket | Closed Frame | Through Hole | 1 | 2.54 mm | SKT | 19 | - | - | - | - | - | - | - | - | - | - | - | - | - | 19 (1 x 19) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
 Conn Board to Board F 200 POS 1.27mm Solder RA Thru-Hole 1.27 [.050] Series I, HD, FH and J Connectors 200 50SR CMP LP R/A RCPT DOCK I/O Connectors 200 50SR CMP LP R/A RCPT DOCK te connectivity / amp | 10 | 168: ¥285.8706 | Bulk | Contains lead / RoHS non-compliant | Solder | Gold Over Nickel | Board to Board | Board Lock | Right Angle | 4 | 1.27 mm | F | 200 POS | 200 | Thru Hole (SMT Compatible) | - | Liquid Crystal Polymer (LCP) | - | - | 盒 | - | - | - | 30µin (0.76µm) | UL 94V-0 | - | - | - | 插座 | Blindmate | AMP | - | - | - | - | - | - | Not ELV/RoHS compliant | - | Outer Shroud Contacts | Low | 2.49 [0.098] | Connector | 5787882-1 | - | Without | Standard | - | 24 | - | - | - | - | - | - | - | - | - | - | - | Tin-Lead over Nickel | 自然 | - | 磷青铜 | 板锁 | With | - | - | - | - | 80 Days | Connector SCSI | Stainless Steel | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 24 | 8-Row [8-Row] | With | .81 – 1.2 mm [ .032 – .047 in ] | 铜镀镍 | Natural | Nickel over Copper | Nickel over Copper | Mating Side; Female Screwlock | Steel | Without | 0.81 â 1.20 [0.032 â 0.047] | With | 1.27 [0.050] | 铜打底镀镍 | 镍打底镀锡铅 | - | - | - |
 Conn SCSI PL 80 POS 2.54mm Solder RA Thru-Hole 80 Terminal 1 Port 1.27 [.050] Series I, HD, FH and J Connectors CONN PLUG 80POS .050" RT ANG I/O Connectors R.A. PLUG 80P Series I HI-TEMP Conn SCSI PL 80 POS 2.54mm Solder RA Thru-Hole 80 Terminal 1 Port Product Highlights:ConnectorPlugNumber of Positions = 801.27 mm CenterlineStandard Profile Champ 050 series,plug assembly te connectivity / amp | 10 | 1: ¥64.778 | Bulk | Lead free / RoHS Compliant | Solder | Tin | SCSI | Board Lock | Through Hole | 2 | 2.54 mm | PL | 80 | 80 | Thru Hole | Phosphor Bronze | Liquid Crystal Polymer (LCP) | I/O Connectors | 21 | - | -55C to 105C | 7.5 mm | 1.27 [0.050] | Flash | UL 94V-0 | 17.46 mm | - | SCSI Connectors | Solder Tail | Series I | AMP | - | - | - | - | - | - | RoHS compliant, ELV compliant | Black | Center Strip Contacts | Standard | 3.10 [0.122] | Connector | Board To Board Applications | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c | Without | Standard | 1/Contact A | - | - | - | - | 1 Port | - | - | - | - | - | - | - | Tin-Copper over Nickel | - | - | - | - | - | - | 250VAC | - | 105C | - | - | Brass | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 13.20 [0.520] | - | - |
 Conn DIP Socket SKT 40 POS 2.54mm Solder ST Thru-Hole Tube DIP Sockets CONN IC SOCKET 40POS DIP 15AU IC & Component Sockets 40P ECONOMY GOLD Conn DIP Socket SKT 40 POS 2.54mm Solder ST Thru-Hole Tube Product Highlights:DIP SocketNumber of Positions = 40Row-to-Row Spacing = 15.49 mmThru HoleMount Style = VerticalSearch Keywords:IC sockets, solderless, NIC, Network Interface Cards, PC Cards, EIA RS-415, MIL-S-83734, dual in-line IC package, Socket,DIP;DualLeaf;40Pos.;0.100In.cen.;ThruHole;0.610In.;PhosphorBronze TE Connectivity 2.54mm 节距 40 路, 通孔 标准引脚 DIL 插座 te connectivity / amp | 10 | 1: ¥14.348 | Rail / Tube | Lead free / RoHS Compliant | Solder | Tin | DIP Socket | Open Frame | Through Hole | 2 | 2.54 mm | SKT | 40 | 40 | Vertical | Phosphor Bronze | Thermoplastic Glass Reinforced | IC & Component Sockets | 10 | Tube | +125°C | 5.33 mm | 2.54 [0.100] | 15µin (0.38µm) | UL 94V-0 | - | 40 (2 x 20) | DIP / SIP Sockets | Through Hole | - | Tyco Electronics | No | 30 | 10,000 | 15.49 mm | Thermoplastic | - | RoHS compliant, ELV compliant | Black | - | Standard | 3.25 [0.128] | DIP Socket | - | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c | - | - | - | Tube | Dual Leaf | - | - | - | - | DIP | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Ladder | 15.49 [0.610] | 5.33 [0.210] | ONLY sockets with straight solder tails are recommended for automatic insertion | DIPLOMATE DL | Straight | 125 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 焊接 | 标准引脚 |
 Conn DIP Socket SKT 40 POS 2.54mm Solder ST Thru-Hole Tube DIP Sockets CONN IC SOCKET 40POS DIP 15AU IC & Component Sockets 40 CLOSED FRAME GOLD Conn DIP Socket SKT 40 POS 2.54mm Solder ST Thru-Hole Tube Product Highlights:DIP SocketNumber of Positions = 40Row-to-Row Spacing = 15.49 mmThru HoleMount Style = VerticalSearch Keywords:IC sockets, solderless, NIC, Network Interface Cards, PC Cards, EIA RS-415, MIL-S-83734, dual in-line IC package, DIP.600CLDLPHBR/AU,40CDIPLOMATESOK15AUPHBZ te connectivity / amp | 256 | 4: ¥9.18 | Rail / Tube | Contains lead / RoHS non-compliant | Solder | Gold | DIP Socket | Closed Frame | Through Hole | 2 | 2.54 mm | SKT | 40 | Not Required | Through Hole | Phosphor Bronze | Thermoplastic | IC & Component Sockets | 10 | Tube | + 125 C | 5.33 mm | 50.67 mm | 15µin (0.38µm) | - | 17.63 mm | 40 (2 x 20) | DIP / SIP Sockets | Solder | - | - | No | 30 mohm | 10000 Mohm | 15.24 mm | Thermoplastic | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
 Conn SCSI RCP 40 POS 2.54mm Solder ST Thru-Hole 40 Terminal 1 Port 1.27 [.050] Series I, HD, FH and J Connectors CONN RCPT 40POS VERT .050 T/H Board to Board & Mezzanine Connectors 050 series 40p 30 Au Conn SCSI RCP 40 POS 2.54mm Solder ST Thru-Hole 40 Terminal 1 Port Product Highlights:ConnectorApplies To Printed Circuit BoardHousing Gender = Receptacle40 Positions1.27 mm Centerline Champ050 series,40pos,Au over PdNi te connectivity / amp | 224 | 100: ¥17.272 | Rail / Tube | Lead free / RoHS Compliant | Solder | Tin | SCSI | Board Guide, Board Lock | Through Hole | 2 | 2.54 mm | RCP | 40 | 40 | Thru Hole | Phosphor Bronze | PPA | Board to Board & Mezzanine Connectors | 1296 | Tube | -55C to 85C | 10 mm | 1.27 [0.050] | Flash | UL 94V-0 | 7.1 mm | - | - | - | Series I | AMP | - | - | - | - | - | - | RoHS compliant, ELV compliant | Black | Outer Shroud Contacts | Standard | 2.54 [0.100] | Connector | Board To Board Applications | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c | With | Standard | 1/Contact A | - | - | Brass | Tin-Copper over Nickel | 1 Port | - | - | - | - | - | - | 17341014 | - | - | Keying Post | - | - | - | - | 250VAC | - | 85C | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
 Conn DIP Socket SKT 14 POS 2.54mm Solder ST Thru-Hole Tube DIP Sockets CONN IC SOCKET 14POS DIP TIN Socket; DIP;Dual Leaf;14 Pos.;0.100In.cen.;Thru Hole;0.310In.;Ber. Copper;Tin IC & Component Sockets 14C DIPLOMATE SOK Conn DIP Socket SKT 14 POS 2.54mm Solder ST Thru-Hole Tube Product Highlights:DIP SocketNumber of Positions = 14Row-to-Row Spacing = 7.87 mmThru HoleMount Style = VerticalSearch Keywords:IC sockets, solderless, NIC, Network Interface Cards, PC Cards, EIA RS-415, MIL-S-83734, dual in-line IC package, Socket,DIP;DualLeaf;14Pos.;0.100In.cen.;ThruHole;0.310In.;Ber.Copper;Tin te connectivity / amp | 1315 | 1: ¥5.304 | Bulk | Lead free / RoHS Compliant | Solder | Tin | DIP Socket | Closed Frame | Through Hole | 2 | 2.54 mm | SKT | 14 | Not Required | Through Hole | Beryllium Copper | Thermoplastic | IC & Component Sockets | 3000 | Tube | - 55 C to + 125 C | 5.33 mm | 17.65 mm | - | UL 94 V-0 | 10.01 mm | 14 (2 x 7) | DIP / SIP Sockets | - | - | - | No | 30 mohm | 10000 Mohm | 7.62 mm | Thermoplastic | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |