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5747841-2

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5747841-2

制造商
TE Connectivity Ltd.
描述Conn D-Subminiature PIN 15 POS 2.74mm Solder RA Thru-Hole 15 Terminal 1 Port D-Sub Standard Connectors 15 MSFL PLUG RA 318 (FM BL) Standard Board Mount Connectors CONN D-SUB PLUG R/A 15POS Conn D-Subminiature PL 15 POS 2.74mm Solder RA Thru-Hole 15Terminal 1Port Conn D-Subminiature PIN 15 POS 2.74mm Solder RA Thru-Hole 15 Terminal 1 Port Product Highlights:15 PositionsConnector Style = PlugPCB Mount Angle = Right AngleProduct Series = HD 20Without Mating Connector LockSearch Keywords:Subminiature D, AMPLIMITE, MIL-C-24308, DIN 41652, Mark II, Mark III, DIN 41494, box to box, military/aerospace, 13C3, 3C3, HD-22, ACTION PIN, d-sub, d sub, dsub HD20 Series 15 Position Right Angle Plug Board Mount D-Sub Connector 15 MSFL PLUG RA 318 (FM,BL)
分类
对参数有疑问?问 AI 助手

商业参数

产品类别D-Sub Standard Connectors标准包装数量Trays
工厂包装数量104

合规参数

RoHSRoHS Compliant无铅定义Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c
RoHS/ELV合规状态RoHS compliant, ELV compliant材料阻燃等级UL 94V-0

电气参数

接地方式Without额定电压125V
最大额定电流6A

机械参数

颜色Black间距2.74 mm
密封型No外形尺寸(长x宽)2
镀层Tin over Nickel占位面积8.08 [.318]
包装方式Tray壳体颜色黑色
引脚样式Round外壳尺寸2
端接方式Solder触点形式Signal
触头类型Signal外壳表面处理
第二连接器Without触点形状Round
安装类型Through Hole外壳镀层Tin
连接器类型Plug, Male Pins接触镀层Gold
法兰特征Housing/Shell (Unthreaded)接地类型With
尖端材料(笔尖)Tin over Copper Flash安装样式Through Hole
排数2壳体镀层镀锡铜薄层
外壳材料(壳体)Steel电路板厚度0.062 [1.57]
连接器样式D-Sub插入件材料黄铜
磁芯材质黄铜外形(宽 x 高)Standard
触头材料Brass壳体材料Thermoplastic
安装特性板锁包装数量104
面板安装类型Without尺寸/外形0.66 [.026]
接地凹痕With端接样式Through Hole
连接器颜色None外径.66 mm [ .026 in ]
触点数15位数15
外壳尺寸-插件Front Metal Shell安装孔直径3.18 [.125]
外壳材料及表面处理Steel, Tin Plated端子柱长度3.18 [0.125]
接触镀层厚度Flash触点材料 - 镀层
外壳与棱镜材料后壳材料及镀层镍打底镀锡
外壳尺寸,连接器布局2 (DA, A)

产品信息

备注Plugs are preloaded with size 20 DF posted pin contacts类型D-Subminiature
连接器性别PIN系列HD-20
产品特性Board Lock, Ground Strap, Grounding Indents可密封
主要用途Board Lock, Ground Strap, Grounding Indents制造商全称AMP
预装产品子类型连接器
其他规格

环境参数

工作温度-55°C ~ 105°C封装热阻1.57 mm [ .062 in ]

文档与媒体

在线文档

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