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146274-8
| 制造商 | TE Connectivity Ltd. |
| 描述 | Conn Unshrouded Header HDR 8 POS 2.54mm Solder ST Thru-Hole AMPMODU Breakaway Headers CONN HEADER BRKWAY 8POS SGL .100 Headers & Wire Housings 08 MODII HDR SRST B/A .100CL 08 MODII HDR SRST B/A .100CL 08 MODII HDR SRST B/A .100CL Search Keywords:board to board, AMPMODU, pcb connectors, |
| 分类 |
商业参数
| 商标名 | AMPMODU | 标准包装规格 | 200 |
| 产品类别 | Headers & Wire Housings | 标准包装数量 | Bulk |
合规参数
| RoHS | Contains lead / RoHS non-compliant | 无铅定义 | Reflow solder capable to 245°C / Reflow solder capable to 260°C |
| 标准编号 | CSA LR7189, UL E28476 | RoHS/ELV合规状态 | Not ELV/RoHS compliant |
| 材料阻燃等级 | UL 94V-0 | ||
电气参数
| 额定交流电压 | 30 | 最大额定电流 | 3 |
| 保护额定电压（VPR） | 750 V | ||
机械参数
| 颜色 | Black | 间距 | 2.54 mm |
| 底座类型 | 带有 | 锁定类型 | 不带 |
| 包装方式 | Bulk | 壳体颜色 | 黑色 |
| 引脚样式 | 正方形 | 稳定器 | 不带 |
| 排间距 | 2.54 mm | 端接方式 | Solder |
| 触头类型 | Male Pin | 第一连接器 | No |
| 第二连接器 | Without | 触点形状 | Square |
| 安装类型 | Without | 连接器类型 | Breakaway |
| 接触镀层 | Tin-Lead Over Nickel | 安装样式 | 标准 |
| 排数 | 1 | 插入件材料 | 磷青铜 |
| 触头材料 | Phosphor Bronze | 壳体材料 | Liquid Crystal Polymer (LCP) |
| 安装特性 | Without | 包装数量 | 200 |
| 面板安装类型 | Without | 主要材料 | Phosphor Bronze |
| 尺寸/外形 | 0.64 [.025] | 端接样式 | Through Hole |
| 第一连接器类型 | 分离 | 第一触头极性 | Pin (Male) |
| 外径 | .64 mm [ .025 in ] | 触点数 | 8 |
| 端接表面处理 | 不带 | 位数 | 8 |
| 排距 - 配合 | 2.54 | 中心触点表面处理 | 2.54 |
| 柱体长度（配合） | 8.08 | 安装孔直径 | 不带 |
| 接触长度 - 配合 | 0.318" (8.08mm) | 表面贴装焊盘尺寸 | Yes |
| 端子柱长度 | 3.18 | 接触镀层厚度 | 100µin (2.54µm) |
| 安装面板厚度 | With | 触点材料 - 配合 | Tin-Lead |
| 静电放电屏蔽 | 不带 | 第一连接器安装特征 | 否 |
产品信息
| 类型 | Unshrouded Header | 连接器性别 | HDR |
| 系列 | AMPMODU MOD II | 钥匙类型 | 否 |
| 制造商全称 | AMP | 产品子类型 | Connector |
| 选择性装载 | No | 加载位置数 | All |
环境参数
| 密封等级 | 不带 | 温度 | Yes |
| 工作温度 | -65 – 105 | 封装热阻 | 1.57 mm [ .062 in ] |
| 结工作温度 | 是 | ||
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