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OMAPL138BZWT3
| 制造商 | Texas Instruments Incorporated |
| 描述 | Applications Processor 361-Pin NFBGA Digital Signal Processors & Controllers - DSP, DSC Low-Pwr App Proc IC APPLICATIONS PROC LP 361NFBGA DSP, 32BIT, 300MHZ, NFBGA-361 DSP, 32BIT, 375/456MHZ, NFBGA-361 |
| 分类 |
商业参数
| 产品 | DSPs | 商标名 | OMAP Application Processor |
| 其他名称 | 296-28038 | 产品类别 | Digital Signal Processors & Controllers - DSP, DSC |
| 标准包装数量 | Trays | 工厂包装数量 | 90 |
| 标准封装名称 | BGA | ||
合规参数
| RoHS | RoHS Compliant | SVHC | :No SVHC (16-Dec-2013) |
| 欧盟RoHS | Compliant | 海关税号 | 85423190 |
| 抗辐射加固 | No | ||
电气参数
| 转速 | 375MHz | 电压 | 0.95 V ~ 1.35 V |
| 核心类型 | ARM926EJ-S+C674x | 频率 | :456MHz |
| 接口 | I2C, SPI, UART | 时钟速率 | 300 MHz |
| 存储器容量 | 64 KB | 位数 | :32 bit |
| 核心电压 | :950mV | FPGA 核心单元数 | :3648 |
| 供电电压 | 1.3 V | 共模瞬态抗扰度（最小） | Commercial |
机械参数
| 宽度 | 16 | 重量 | 0 |
| 包装方式 | Tray | 安装类型 | Surface Mount |
| 安装样式 | SMD/SMT | 引脚数 | :361 |
| 封装形式 | 361NFBGA | 冷却的封装 | NFBGA |
| 材料表面处理 | :MSL 3 - 168 hours | 总长度 | 16 |
| 包装数量 | NFBGA | 位数 | 361 |
| 外壳尺寸-插件 | 0.9 | 供应商器件封装 | 361-NFBGA (16x16) |
| 核心数/总线宽度 | 16 bit | ||
产品信息
| 类型 | OMAP-L138 | 系列 | OMAP-L138 |
| 核心处理器 | OMAP-L138 | 指令类型 | Fixed/Floating Point |
| 射频系列/标准 | OMAP-L138 | 印刷电路板数量 | 361 |
环境参数
| 工作温度 | 0 to 90 °C | 结工作温度 | 0C |
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