Winbond Electronics
所示图像仅为示意图。请从产品数据表中获得准确的规格。
| Type | Description |
|---|---|
| Mounting | Surface Mount |
| Package Width | 8 |
| Organization | 32Mx16 |
| PCB | 60 |
| Address Bus Width | 15 |
| Type | Mobile LPDDR SDRAM |
| Typical Operating Supply Voltage | 1.8 |
| EU RoHS | Compliant |
| Density | 512M |
| Number of Internal Banks | 4 |
| Minimum Operating Temperature | -25 |
| Supplier Package | VFBGA |
| Standard Package Name | BGA |
| Maximum Operating Temperature | 85 |
| Maximum Clock Rate | 200 |
| Data Bus Width | 16 |
| Package Length | 9 |
| Minimum Operating Supply Voltage | 1.7 |
| Pin Count | 60 |
| Maximum Operating Current | 55 |
| Package Height | 0.66 |
| Maximum Random Access Time | 6.5|5 |
| Number of Words per Bank | 8M |
| Maximum Operating Supply Voltage | 1.95 |
| Lead Shape | Ball |
| Packaging | Tray |
| Format - Memory | RAM |
| Supplier Device Package | 60-VFBGA (8x9) |
| Memory Type | Mobile LPDDR SDRAM |
| Operating Temperature | -25°C ~ 85°C |
| Memory Size | 512M (32M x 16) |
| Voltage - Supply | 1.7 V ~ 1.95 V |
| Standard Package | 312 |
| Interface | Parallel |
| Speed | 200MHz |
| Package/Case | 60-TFBGA |
| rohs | Lead free / RoHS Compliant |
| RESOURCE TYPE | LINK |
|---|---|
| Datasheets |
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