TDK Corporation
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| Type | Description |
|---|---|
| Unit Pack | 1000 |
| MOQ | 1000 |
| Ratings | AEC-Q200 |
| Capacitance | 10µF |
| Mounting Type | Surface Mount, MLCC |
| Voltage - Rated | 25V |
| Packaging | Tape & Reel (TR) |
| Temperature Coefficient | X7R |
| Size / Dimension | 0.126" L x 0.098" W (3.20mm x 2.50mm) |
| Applications | Automotive |
| Operating Temperature | -55°C ~ 125°C |
| Standard Package | 1,000 |
| Thickness (Max) | 0.110" (2.80mm) |
| Package/Case | 1210 (3225 Metric) |
| Tolerance | ±10% |
| rohs | Lead free / RoHS Compliant |
| Other Names | 445-7000-1 |
| Product | Automotive MLCCs |
| Operating Temperature Range | - 55 C to + 125 C |
| Series | CGA |
| Case Code - mm | 3225 |
| Voltage Rating | 25 V |
| Termination Style | SMD/SMT |
| Case Length | 3.2 mm |
| Case Code - in | 1210 |
| Case Height | 2.5 mm |
| Package / Case | 1210 (3225 metric) |
| Case Width | 2.5 mm |
| Temperature Coefficient / Code | X7R |
| Type | Automotive Multilayer Ceramic Chip Capacitor |
| Part # Aliases | CGA6P1X7R1E106K |
| RoHS | RoHS Compliant |
| 温度系数 | ±15% |
| 系列 | CGA |
| 电压 | 25 V 直流 |
| 容差 | ±10% |
| 最高工作温度 | +125°C |
| 容差 正 | +10% |
| 端子类型 | 焊接 |
| 高度 | 2.5mm |
| 电容值 | 10 µF |
| 最低工作温度 | -55°C |
| 电容器系列 | 多层 |
| Board Level Components | Y |
| 长度 | 3.2mm |
| 抑制类别 | Class II |
| 层数 | Multi-Layer |
| 封装/外壳 | 3225 |
| 容差 负 | -10% |
| 深度 | 2.5mm |
| 电介质材料系列 | 陶瓷 |
| 尺寸 | 3.2 x 2.5 x 2.5mm |
| 电介质 | X7R |
| Tape type | 7" |
| Style | CHIP |
| T(A) min | -55 °C |
| Diameter/width | 2.5 mm |
| Electrodes | BME |
| Package | 1210 |
| T(A) max | +125 °C |
| Automotive | AEC-Q(200) |
| C(N) | 10µ F |
| Length | 3.2 mm |
| Height | 2.5 mm |
| Design / type | STANDARD |
| Notes | AECQ200 |
| Leadfree Defin | RoHS-conform |
| Case size | 1210 |
| Dielectric | X7R |
| Termination | NISN |
| V(N) | 25 V |
| Purpose of use | AUTOMOTIVE |
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