TE Connectivity
所示图像仅为示意图。请从产品数据表中获得准确的规格。
| Type | Description |
|---|---|
| Product Category | Heat Sinks |
| RoHS | RoHS Compliant |
| Product | Heat Sinks |
| Heatsink Material | Aluminum |
| Fin Style | Radial |
| Height | 9.06 mm |
| Designed for | BGA Semiconductor Packages |
| Diameter | 25 mm |
| Packaging | Tray |
| Comment | Heat sink assembly includes Two Leg Standard Clip, Part Number 1542367-1. |
| RoHSELV Compliance | RoHS compliant, ELV compliant |
| Lead Free Solder Processes | Not relevant for lead free process |
| Finish | Black Anodize |
| Height (mm (in)) | 9.06 [0.357] |
| Diameter (mm (in)) | 25.00 [0.984] |
| Package Size (mm (in)) | 25 [.985] |
| Material | Aluminum |
| Device Type | BGA |
| Heat Sink Type | 2 Fin Radial |
| For Use With | BGA Semiconductor Packages |
| Line | ChipCoolers |
| Product Type | Heat Sink |
| RoHSELV Compliance History | Converted to comply with RoHS directive |
| Height Off Base (Height of Fin) | 0.357" (9.07mm) |
| Thermal Resistance @ Natural | 14.2°C/W |
| Attachment Method | Clip |
| Shape | Cylindrical |
| Material Finish | Black Anodized |
| Package Cooled | BGA |
| Standard Package | 250 |
| Thermal Resistance @ Forced Air Flow | 8.1°C/W @ 200 LFM |
| Other Names | 515420006 |
| rohs | Lead free / RoHS Compliant |
| Rad Hardened | No |
| Type | Passive |
| Body Material | Aluminum |
| Product Height (mm) | 9.06 mm |
| Device Cooled | BGA |
| Product Diameter (mm) | 25 mm |
| 附件类型 | 卡箍 |
| 电镀材料 | 黑色阳极氧化处理 |
| 适用于 | BGA 半导体封装 |
| 材料 | 铝 |
| 高度 | 9.06 mm [ .357 in ] |
| 注释 | 散热器组件包括双支脚标准卡箍，部件号为 1542367-1。 |
| 宽度 (in) | .984 |
| 直径 | 25 mm [ .984 in ] |
| I/O 插拔式 | 否 |
| 散热片数量 | 2 |
| 产品类型 | 散热器 |
| 器件类型 | BGA |
| 散热片种类 | 径向 |
| 电源 (W) | 10, 15, 5 |
| RESOURCE TYPE | LINK |
|---|---|
| Datasheets |
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