te connectivity / amp
所示图像仅为示意图。请从产品数据表中获得准确的规格。
| Type | Description |
|---|---|
| Type | Passive |
| Device Cooled | BGA |
| Attachment Method | Clip |
| Product Height | 11.23 mm |
| Fin Style | Radial |
| Finish | Black Anodized |
| Material | Aluminum |
| Standard Package | Bulk |
| RoHS | RoHS Compliant |
| Comment | Mounting clip does not increase overall heat sink height.; Heat sink assembly i |
| RoHSELV Compliance | RoHS compliant, ELV compliant |
| Lead Free Solder Processes | Not relevant for lead free process |
| Height (mm (in)) | 11.23 [0.442] |
| Diameter (mm (in)) | 34.92 [1.375] |
| Package Size (mm (in)) | 25 [.985] |
| Device Type | BGA |
| Flammability Rating | UL 94V-0 |
| Fan Type | No Fan |
| Heat Sink Type | 3 Fin Radial |
| For Use With | BGA Semiconductor Packages |
| Line | ChipCoolers |
| Product Type | Heat Sink |
| RoHSELV Compliance History | Always was RoHS compliant |
| Series | * |
| Other Names | HTS568-U |
| rohs | Lead free / RoHS Compliant |
| Standard Pack: | 25 |
| 附件类型 | 卡箍 |
| 热阻 (°C) | 10.07, 10.94, 12.04, 3, 3.24, 3.26, 4.3, 4.49, 4.59, 6.32, 6.44 |
| 风扇类型 | 无风扇 |
| 电源 (W) | 10, 15, 5 |
| 适用于 | BGA 半导体封装 |
| 材料 | 铝 |
| 高度 | 11.23 mm [ .442 in ] |
| 注释 | 安装卡箍不会增加整体散热器高度。, 散热器组件包括四支脚标准卡箍，部件号为 1542026-1。 |
| 宽度 (in) | 1.375 |
| 直径 | 34.92 mm [ 1.375 in ] |
| I/O 插拔式 | 否 |
| 风速 (LFM) | 0, 200, 400, 600 |
| 散热片数量 | 3 |
| 产品类型 | 散热器 |
| 电镀材料 | 黑色阳极氧化处理 |
| 器件类型 | BGA |
| 散热片种类 | 径向 |
| UL 易燃性等级 | UL 94V-0 |
| RESOURCE TYPE | LINK |
|---|---|
| Datasheets |
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