te connectivity / amp
所示图像仅为示意图。请从产品数据表中获得准确的规格。
| Type | Description |
|---|---|
| Type | Backplane |
| Number of Contacts | 180 |
| Termination Method | Solder |
| Mounting | Through Hole |
| Contact Plating | Gold Over Palladium Nickel |
| Standard Package | Bulk |
| RoHSELV Compliance | ELV compliant |
| Lead Free Solder Processes | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c |
| Receptacle PowerGround Material | Phosphor Bronze |
| Mating Type | Receptacle |
| Solder Tail Contact Plating | Tin-Lead over Nickel |
| Brand | AMP |
| Stiffener Material | Aluminum |
| Housing Material | Liquid Crystal Polymer (LCP) |
| PCB Mount Angle | Right Angle |
| Lead Length (mm (in)) | 4.19 [0.165] |
| Housing Color | Black |
| PCB Retention Feature | No |
| Contact Mating Area Plating Material | Gold Flash over Palladium Nickel |
| Product Type | Connector |
| RoHSELV Compliance History | Always was ELV compliant |
| Number of Positions | 180 |
| Receptacle Signal Material | Phosphor Bronze |
| RESOURCE TYPE | LINK |
|---|---|
| Datasheets |
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