te connectivity / amp
所示图像仅为示意图。请从产品数据表中获得准确的规格。
| Type | Description |
|---|---|
| Type | Passive |
| Device Cooled | BGA |
| Attachment Method | Clip |
| Product Height | 6.47 mm |
| Fin Style | Radial |
| Finish | Black Anodized |
| Material | Aluminum |
| Standard Package | Bulk |
| Comment | Mounting clip does not increase overall heat sink height. |
| RoHSELV Compliance | RoHS compliant, ELV compliant |
| Lead Free Solder Processes | Not relevant for lead free process |
| Height (mm (in)) | 6.47 [0.255] |
| Diameter (mm in) | 34.92 [1.375] |
| Package Size (mm (in)) | 35 [1.379] |
| Device Type | BGA |
| Flammability Rating | UL 94V-0 |
| Heat Sink Type | 1 Fin Radial |
| For Use With | BGA Semiconductor Packages |
| Line | ChipCoolers |
| Product Type | Heat Sink |
| RoHSELV Compliance History | Converted to comply with RoHS directive |
| Series | * |
| Other Names | HTS559-U |
| rohs | Lead free / RoHS Compliant |
| Standard Pack: | 25 |
| 附件类型 | 卡箍 |
| 热阻 (°C) | 10.6, 11.46, 12.77, 4.31, 4.41, 4.51, 5.21, 5.26, 5.45, 7.93, 8.05, 8.19 |
| 电源 (W) | 10, 15, 5 |
| 适用于 | BGA 半导体封装 |
| 材料 | 铝 |
| 高度 | 6.47 mm [ .255 in ] |
| 注释 | 安装卡箍不会增加整体散热器高度。 |
| 宽度 (in) | 1.375 |
| 直径 | 34.92 mm [ 1.375 in ] |
| I/O 插拔式 | 否 |
| 风速 (LFM) | 0, 200, 400, 600 |
| 散热片数量 | 1 |
| 产品类型 | 散热器 |
| 电镀材料 | 黑色阳极氧化处理 |
| 器件类型 | BGA |
| 散热片种类 | 径向 |
| UL 易燃性等级 | UL 94V-0 |
| RESOURCE TYPE | LINK |
|---|---|
| Datasheets |
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