te connectivity / amp
所示图像仅为示意图。请从产品数据表中获得准确的规格。
| Type | Description |
|---|---|
| Type | DIP Socket |
| Gender | SKT |
| Number of Contacts | 42 |
| Pitch | 2.54 mm |
| Termination Method | Solder |
| Mounting | Through Hole |
| Body Orientation | Straight |
| Number of Rows | 2 |
| Standard Package | Bulk |
| Mating Contact Type | Dual Leaf |
| PCB Mount Angle | Horizontal |
| Contact Style | Stamped + Formed |
| Contact Resistance (mΩ) | 30 |
| Contact Mount | Thru Hole |
| Number of Positions | 42 |
| Profile | Standard |
| Lead Free Solder Processes | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c |
| Row-to-Row Spacing (mm in) | 15.24 [0.600] |
| Centerline (mm in) | 2.54 [0.100] |
| Leg Style | Straight |
| Product Type | DIP Socket |
| RoHSELV Compliance | RoHS compliant, ELV compliant |
| Frame Style | Ladder |
| Packaging Method | Tube |
| Contact Mating Area Plating Material | Tin |
| Temperature Range (°C) | -40 â +105 |
| Insulation Resistance (MΩ) | 10,000 |
| Mount Style | Vertical |
| Height Above PC Board (mm (in)) | 5.10 [0.200] |
| Contact Material | Phosphor Bronze |
| RoHSELV Compliance History | Always was RoHS compliant |
| Termination (Solder) Post Length (mm (in)) | 3.00 [0.118] |
| Features | Open Frame |
| Mounting Type | Through Hole |
| Contact Finish | Tin |
| Number of Positions or Pins (Grid) | 42 (2 x 21) |
| Contact Finish Thickness | 60µin (1.52µm) |
| rohs | Lead free / RoHS Compliant |
| Factory Pack Quantity | 1100 |
| Product | DIP / SIP Sockets |
| Product Category | IC & Component Sockets |
| RoHS | RoHS Compliant |
| RESOURCE TYPE | LINK |
|---|---|
| Datasheets |
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