te connectivity / amp
所示图像仅为示意图。请从产品数据表中获得准确的规格。
| Type | Description |
|---|---|
| Type | Continuous Post Contact |
| Gender | M |
| Contact Plating | Gold Over Nickel |
| Termination Method | Solder |
| Standard Package | Bulk |
| Length - Overall | 0.490" (12.45mm) |
| Mounting Type | Through Hole |
| Mounting Hole Diameter | 0.029" ~ 0.033" (0.74mm ~ 0.84mm) |
| Board Thickness | 0.100" (2.54mm) |
| Contact Finish | Gold |
| Packaging | Tape & Reel (TR) |
| Pin Size - Below Board | 0.025" (0.64mm) Square |
| Pin Size - Above Board | 0.025" (0.64mm) Square |
| Insulation | Non-Insulated |
| Termination | Press-Fit |
| Contact Finish Thickness | 15µin (0.38µm) |
| Terminal Type | Smooth |
| Contact Material | Copper Alloy |
| rohs | Lead free / RoHS Compliant |
| Current Rating | 3 A |
| Tradename | AMPMODU |
| Operating Temperature Range | - 55 C to + 125 C |
| Series | AMPMODU MOD II |
| RoHS | RoHS Compliant |
| Standard Pack: | 80,000 |
| 端子接触部电镀厚度 (µin) | 15 |
| スター | 不带 |
| 端子类型 | 插针 |
| 結線端のめっき厚 (µin) | 15 |
| 端子形状 | 正方形 |
| 封装方法 | 卷 |
| 绝缘电阻 (MΩ) | 5000 |
| 端子基材 | 黄铜 |
| 长度 | 12.45 mm [ .49 in ] |
| Contact Current Rating (Max) (A) | 3 |
| 柱体尺寸 | .64 mm [ .025 in ] |
| 結線端のめっき材質 | 金 |
| 介质耐压 | 750 V |
| 端子接触部电镀材料 | 金 |
| 产品类型 | 接触件 |
| 端子構成 | 连续柱体 |
| PCB 安装方向 | 垂直 |
| 封装数量 | 80000 |
| 连接器和端子端接到 | 印刷电路板 |
| 工组温度范围 (°C) | -55 – 125 |
| 穴のサイズ (推奨) (mm) | .74 |
| PCB 厚度（建议） (mm) | 2.54 |
| RESOURCE TYPE | LINK |
|---|---|
| Datasheets |
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